Product description:
Characteristics:
- Lead-free solder 0.8 mm, ideal for use with microelectronics, fine wires and most other electrical and electronic soldering applications
- Tin-lead has a melting point of 217 °C
- Tin-silver-copper solder has a lower melting point, 207°C, and produces a low-resistance solder joint
- Designed for the toughest jobs where precision is extremely important
Key features according to our expert
-
Thickness: 0,8 mm
-
Relative density: 1
-
ADR packing group: Not applicable
-
Length: 2000 mm
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UN number: Not applicable
-
Principal hazard property: GHS07 Harmful or irritant
-
ADR class: Not applicable
-
Conseils de prudence (P): P305 + P351 + P338
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H-statements: H319; H335
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Hazard class: GHS07 Harmful or irritant
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Physical state: Solid
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Based on: Tin
Hazard statements
- H319: Causes serious eye irritation.
- H335: May cause respiratory irritation.
Precautionary statements
- P305 + P351 + P338: IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing.
Specifications / All features
- Thickness
- 0,8 mm
- Relative density
- 1
- Adr packing group
- Not applicable
- Length
- 2000 mm
- Un number
- Not applicable
- Principal hazard property
- GHS07 Harmful or irritant
- Adr class
- Not applicable
- Conseils de prudence (p)
- P305 + P351 + P338
- H-statements
- H319; H335
- Hazard class
- GHS07 Harmful or irritant
- Physical state
- Solid
- Based on
- Tin
- Solder
- 0.75 Cu 99.25 Sn %
- Total length mm
- 4000 mm
- Weight g
- 15 g